发明名称 Polishing Pad
摘要 <p>The present invention provides a polishing pad whose unevenness in thickness hardly occurs and whose life can be improved. A polishing pad 1 is provided with a polyurethane sheet 2. Foams 3 having lengths of about 1/2 of the length of the polyurethane sheet 2 in its thickness direction and elongated foams 4 having lengths of at least 70% of the length of the polyurethane sheet 2 in the thickness direction are formed in the polyurethane sheet 2. The foams 3 and the elongated foams 4 are opened by buffing processing so that opened pores 5 and opened pores 6 are formed at a polishing face P, respectively. Regarding the opened pores 5, 6, the total number of opened pores having opened pore diameters falling in a range of from 30 to 50µm occupies at least 50% of the number of all opened pores. The total number of the opened pores 5, 6 per 1mm 2 of the polishing face P is set in a range of from 50 to 100. An average value of ratio of an opened pore diameter D1 of the opened pore 6 of the elongated foam 4 to an opened pore diameter D2 of the opened pore 6 at a depth position of at least 200µm from the polishing face P is set in a range of from 0.65 to 0.95.</p>
申请公布号 EP2045038(B9) 申请公布日期 2010.09.08
申请号 EP20080164895 申请日期 2008.09.23
申请人 FUJIBO HOLDINGS INC. 发明人 IWASE, TADASHI;IWAO, TOMOHIRO
分类号 B24B37/26;B24D3/32;B24D13/14 主分类号 B24B37/26
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