| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging body and a method of coating resin capable of securing packaging reliability, by appropriately forming a resin reinforced section for reinforcing the retention force of a solder joint. <P>SOLUTION: In the electronic component packaging body 8, including an electronic component 6 having a rectangular, a planar shape and a chip-type compact component 60 packaged close to a corner section 6c of the electronic component 6; a discontinuous section for preventing a reinforcement resin 7 from being applied onto the compact component 60, at a position where the compact component 60 exists is provided in a first resin line 7a, and a second resin line 7b for composing a corner reinforcement section 70 provided at the corner section 6c, thus appropriately forming the corner reinforcement section 70, without affecting other compact components 60 packaged closely with nonconformities, and securing packaging reliability. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
