| 摘要 |
PROBLEM TO BE SOLVED: To provide a pickup method for selecting a non-defective target chip from a wafer on which chips subjected to pickup and chips not subjected to pickup are arranged. SOLUTION: It is a method to select a non-defective target chip 2 from a wafer 1 on which chips 2 subjected to pickup and chips 3 not subjected to pickup are provided. Only the non-defective target chip 2 is selected by: storing a map 10 in which an address of the target chip 2 and whether the objective chip 2 is defective; storing a mark 5 provided on the wafer 1; storing an address of a standard chip 6 on the map and a positional relation between the mark 5 and the standard chip 6 with the standard chip 6 being the target chip 2 in a position away from a predetermined position; aligning the mark 5 with a recognizable position; and making the address of the standard chip 6 on the map and the standard chip 6 on the wafer correspond to each other so as to match each other based on the positional relation between the mark 5 and the standard chip 6. COPYRIGHT: (C)2010,JPO&INPIT |
