| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a warp of a multilayer wiring board when bonding a reinforcing plate to the multilayer wiring board of a bonding apparatus of the reinforcing plate to the multilayer wiring board of an integrated circuit package. SOLUTION: The multilayer wiring board with a reinforcing plate temporarily fixed by an uncured adhesive agent is provided over the heating metal plate. A pressure bag having a gas intake opening and an exhausting opening is arranged over the multilayer wiring board. The pressure bag expands and contracts by taking in and exhausting gas. The expansion of the pressure bag by the gas intake to the pressure bag depresses the pressure bag to the reinforcing plate and also depresses the pressure bag on the part of the multilayer wiring board other than a part where the reinforcing plate is provided. COPYRIGHT: (C)2010,JPO&INPIT |
