| 摘要 |
PURPOSE: A printed circuit board and a semiconductor package thereof are provided to prevent the contamination of the bonding pad of a semiconductor chip by preventing the spreading of an adhesive through a wetting removing part. CONSTITUTION: A printed circuit board comprises an insulating layer(102), a bond finger(106), and a solder resist(110). An inclined surface(104) is formed in both edges of the insulating layer. A plurality of wetting removing parts are formed in the inclined surface of the insulating layer with a uniform interval. The bond finger is formed between adjacent wetting removing parts. The solder resist is formed in the upper side and the lower side of the insulating layer in order to expose the bond finger and the wetting removing part.
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