| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition method capable of executing sufficient filling in a recess, having a small line width or a small hole diameter, or a recess having a high aspect ratio. SOLUTION: The deposition method is used for forming a thin film on a workpiece W having an insulating layer 4, formed with a recess 6, on its surface. The deposition method has: a barrier-layer forming step for forming a Ti-containing barrier layer 12 on the surface, including the surface in the recess, of the workpiece; a seed-layer forming step for forming a Ru-containing seed layer 16 on the barrier layer; and an auxiliary-seed-layer forming step for forming a Cu-containing auxiliary seed layer 164 on the seed layer in order to assist the conductivity with respect to the seed layer. COPYRIGHT: (C)2010,JPO&INPIT |
