发明名称 MICROCRYSTAL-AMORPHOUS COEXISTING GOLD ALLOY AND PLATED FILM, PLATING LIQUID THEREFOR AND METHOD OF FORMING PLATED FILM
摘要 PROBLEM TO BE SOLVED: To provide a microcrystal-amorphous coexisting gold alloy plated film excellent in electrical characteristics and mechanical characteristics and to provide a plating method of the microcrystal-amorphous coexisting gold alloy plated film. SOLUTION: Properties combining advantage of a crystal structure with that of an amorphous structure can be obtained by allowing a micro crystal phase and an amorphous phase to coexist so as to obtain a volume fraction of crystal phase of 10 to 90%. The microcrystal-amorphous coexisting gold alloy plated film is characterized in that an average particle diameter of the microcrystal is 30 nm or less, a volume fraction of the microcrystal is 10 to 90%, a Knoop hardness is Hk180 or more and a specific resistance is 200μΩ cm or less. The microcrystal-amorphous coexisting gold alloy plated film has an improved hardness and wear-resistance while maintaining specific resistance and chemical stability of gold of its own in such an extent as not to be practically out of the question and is useful for contact material of electric and electronic parts such as relay. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010189685(A) 申请公布日期 2010.09.02
申请号 JP20090033632 申请日期 2009.02.17
申请人 WASEDA UNIV;KANTO CHEM CO INC 发明人 AISAKA TETSUYA;OKINAKA YUTAKA;SENDA KAZUTAKA;IWAI RYOTA;KATO MASARU
分类号 C25D3/62;C25D7/00 主分类号 C25D3/62
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