| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical module capable of reducing influence, on an incorporated component of a mold resin, of heat generated during solder connection between a lead frame and an external circuit board. <P>SOLUTION: In this optical module, a lead frame 1 with an LD 21 mounted thereon is integrally molded by a mold resin 2. The lead frame 1 includes a solder connection part 15 for subjecting the lead frame to solder connection to an external circuit board, and a circuit mounting part 16 incorporated in the mold resin 2, wherein a heat inflow suppression part 14 for suppressing heat inflow from the solder connection part 15 is formed between the solder connection part 15 and the circuit mounting part 16. <P>COPYRIGHT: (C)2010,JPO&INPIT |
