| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount a plurality of semiconductor elements without reducing reliability of a semiconductor device. <P>SOLUTION: The semiconductor device is constituted of: a printed board on which a wiring pattern is formed; a first semiconductor element which is mounted on a prescribed position on the printed board and has a surface composed of a first region having an electrode pad formed thereon and a second region inside the first region; an auxiliary member which is mounted on the second region of the first semiconductor element and has a surface composed of a first region having a wiring pattern formed thereon and a second region inside the first region; and a second semiconductor element which is mounted on the second region of the auxiliary member and has a forming surface of the electrode pad. The electrode pad of the first semiconductor element and the wiring pattern of the printed board are electrically connected; the electrode pad of the second semiconductor element and the wiring pattern of the auxiliary member are electrically connected; the wiring pattern of the auxiliary member and the wiring pattern of the printed board are electrically connected; and the first semiconductor element and the second semiconductor element are sealed with resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
