| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that enables an electronic device to be manufactured having high reliability of electrical connection. <P>SOLUTION: A semiconductor device 1 includes a semiconductor substrate 10, an electrode 12 arranged on a first side 15 thereof, a resin protrusion 20 arranged on the first side 15 that extends in a first direction A, which has a recess 22 extending in a second direction B intersecting the first direction A, and wiring 30 electrically connected to the electrode 12 and formed at least on the recess 22 of the resin protrusion 20. <P>COPYRIGHT: (C)2010,JPO&INPIT |
