| 摘要 |
A light-emitting apparatus is disclosed in which a lead electrode (121a) is held by a resin package (11) having a cup portion formed therein, a light-emitting device (131) is secured on the surface of the lead electrode within the cup portion, and a light-transmitting member 15 is filled in the cup portion so as to seal the light-emitting device. A recessed stepped portion (121b) is formed in that region of the upper surface of the lead electrode held by the resin package which is offset from the secured portion of the semiconductor light-emitting device, the edge portion of the bottom surface of the stepped portion laterally protrudes into the resin package, forming a flange portion (121c), and a vertical cross section of the protruding edge portion forms an approximately acute angle. |
