| 摘要 |
<p>PURPOSE: A multi-chip package and a manufacturing method thereof are provided to improve the light efficiency by forming a reflecting layer of a white silicon epoxy resin in the bottom surface and the inner wall of the cavity. CONSTITUTION: A substrate(30) includes a plurality of electrodes in which a plurality of light-emitting device chips are loaded. A white reflecting layer(34) is formed in the remaining area except for the domain in which the plurality of light-emitting device chips are loaded, in the upper side of the substrate. The reflecting layer is formed in the cavity in order to cover the inner wall and the bottom surface of the cavity. The reflecting layer exposes the upper side of a plurality of electrodes and contacts with the border of the plurality of electrodes.</p> |
