发明名称 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
摘要 A semiconductor device includes a substrate having a resin layer on at least a surface thereof; a thin-film circuit layer provided on the substrate, and a reinforcing section provided on the surface of the substrate so as to surround the thin-film circuit layer.
申请公布号 US7786576(B2) 申请公布日期 2010.08.31
申请号 US20080012182 申请日期 2008.01.31
申请人 SEIKO EPSON CORPORATION 发明人 KODAIRA TAIMEI
分类号 H01L23/04 主分类号 H01L23/04
代理机构 代理人
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