发明名称 |
SEMICONDUCTOR EMBEDDED RESISTOR GENERATION |
摘要 |
<p>A method for generating an embedded resistor in a semiconductor device are provided, the method including forming a shallow trench isolation (STI) region in a substrate; forming a pad oxide on the STI region and substrate; depositing a silicon layer on the pad oxide; forming a photo- resist mask on a portion of the silicon layer; etching the silicon layer to yield a poly-conductor (PC); oxidizing the PC; depositing at least one of an oxide material or a metal gate material on the oxidized surface; depositing a silicon layer on the at least one oxide material or metal gate material; patterning a transistor gate structure disposed substantially away from the STI region. Fig. 15</p> |
申请公布号 |
SG163492(A1) |
申请公布日期 |
2010.08.30 |
申请号 |
SG20100002541 |
申请日期 |
2010.01.14 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD;SAMSUNG ELECTRONICS CO. LTD;INTERNATIONAL BUSINESS MACHINES CORPORATION;INFINEON TECHNOLOGIES NORTH AMERICA CORP.;FREESCALE SEMICONDUCTOR INC. |
发明人 |
CHOONGRYUL RYOU;SEUNGHWAN LEE;JUN YUAN;CHAN VICTOR;ELLER MANFRED;SUNG KIM NAM;KANIKE NARASIMHULU;SAMAVEDAM SRIKANTH BALAJI |
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