发明名称 MANUFACTURING METHOD OF CHIP ON GLASS USING DIRECT IMAGE PROCESS
摘要 PURPOSE: A method for manufacturing a chip on glass using a direction image realizing technology is provided to reduce reduction and loss of a used amount of materials. CONSTITUTION: An AOI(Automatic Optical Inspection) device recognizes the shape of a circular glass substrate square. The AOI device inspects quality of a conductive pattern(S106). Short or open on the conductive pattern is detected of the circular glass substrate by the quality inspection. A short part of the conductive pattern is removed by laser in case on short(S107). Liquefied conductive metal is applied and hardened on an open part of the conductive pattern in case of open. The defect is removed.
申请公布号 KR100978544(B1) 申请公布日期 2010.08.27
申请号 KR20100016154 申请日期 2010.02.23
申请人 NEPCO., LTD. 发明人 PARK, JOONG CHUL
分类号 G02F1/1345;G02F1/13 主分类号 G02F1/1345
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