| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent contact between metal fine wires, and to prevent expansion of conditions of a sealing resin and exposure of the metal fine wires from a package surface. <P>SOLUTION: This semiconductor device includes: a lead frame 3 having an island 2 and an inner lead 1; a semiconductor chip 5A on the island 2; electrodes 6A, 6B on the semiconductor chip 5A; and a plurality of wires connecting the electrodes 6A, 6B to the inner lead 1, and each having a plurality of bending points. A first wire 8 has a slope ascending from a first bending point 8b toward a second bending point 8d, and the second bending point 8d is the highest bending point in the first wire 8. A second wire 9 has a slope descending from a first bending point 9b toward a second bending point 9d, and the second bending point 9d is the lowest bending point in the second wire 9. <P>COPYRIGHT: (C)2010,JPO&INPIT |
