SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate having a structure capable of simplifying a step of manufacturing a laminated chip package, the laminated chip package, a semiconductor plate and a method of manufacturing the same.

SOLUTION: The semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming the plurality of groove portions along the scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form the insulating layers; and forming the wiring electrode including the extended terminal portion extended from the rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion.

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