| 摘要 |
The invention relates to a heat dissipation module having a semiconductor element (2) comprising a first side and an opposing second side (13, 12), to a first electrically conductive heat dissipating body (3) which has a first contact surface (6) with a first section (8) and an adjacent second section (9), to a second electrically conductive heat dissipation body (4) which has a second contact surface (7) that faces the first contact surface (6) and has a third section (10) and adjacent thereto a fourth section (11), the semiconductor element (2) being arranged between the two heat dissipating bodies (3, 4), the first side (13) being joined to the first section (8) and the second side (12) to the third section (10) such that the first side (12) of the semiconductor element (2) is contacted thermally and electrically with the first section (8) of the first contact surface (6) and the second side (12) of the semiconductor element (2) is contacted thermally and electrically with the third section (10) of the second contact surface (7), and the second section (9) being thermally, but not electrically connected to the fourth section (11) by an interposed electric insulating layer (16), characterized in that a current conduction element (5) is arranged between the electric insulating layer (16) and the fourth section (11) of the second contact surface (7), said element being in thermal contact with the insulating layer (16) and in thermal and electric contact with the fourth section (11), wherein the current conduction element (15) comprises an end section (17) extending at least beyond one of the two contact surfaces (6, 7). |
