| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability, having high thermal conductivity when compounded with an inorganic filler and giving a cured article having a low thermal expansion property and excellent moisture resistance; and to provide the cured article obtained by using the same. SOLUTION: This epoxy resin composition includes, as main ingredients, an epoxy resin and a hardener, or an epoxy resin and a hardener as well as an inorganic filler. The epoxy resin composition is obtained by using, as a hardener component, a phenolic compound having a diphenyl ester structure in an amount of≥50 wt.% in the hardener component. COPYRIGHT: (C)2010,JPO&INPIT |
