| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of reliably dividing a wafer into individual devices without impairing a handling property of the thinly ground wafer. SOLUTION: The wafer processing method divides a wafer having a plurality of device regions 17 partitioned by predetermined division lines and an outer peripheral surplus region 19 encircling the device regions into individual devices. The wafer processing method includes the processes of: grinding the back of the device regions to have a given thickness and forming a ring-shaped reinforced portion on the back corresponding to the outer peripheral surplus region; adhering the wafer to a dicing frame 36 via a dicing tape 34 to support the wafer; cutting the predetermined division lines with a cutting blade to divide the wafer into individual devices while holding the wafer on a chuck table having a device region holding portion and a ring-shaped reinforced portion supporting portion; separating the boundary between the device regions 17 and the outer peripheral surplus region with the cutting blade for removal; and picking up the individual devices from the dicing tape. COPYRIGHT: (C)2010,JPO&INPIT |
