| 摘要 |
PROBLEM TO BE SOLVED: To provide a low melting point glass composition substantially free from lead, bismuth and antimony, and sealable at ≤400°C, preferably at ≤380°C, after consideration on environment and safety; a low-temperature sealing material and an electrode material each using the same; also provide an electronic component applying these such as an IC ceramic package, a quartz oscillator, an image display, and a solar cell. SOLUTION: This low melting point glass composition having a softening point of ≤380°C, preferably ≤360°C, contains oxides of vanadium, phosphorus, tellurium and iron. The composition further contains at least one oxide of manganese, zinc, tungsten, molybdenum or barium. Another version of the low melting point glass composition having a softening point of ≤380°C, preferably ≤360°C, contains oxides of vanadium, phosphorus, tellurium, barium, and tungsten or molybdenum, further iron or an alkali metal. COPYRIGHT: (C)2010,JPO&INPIT
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