发明名称 TESTING APPARATUS AND TESTING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a testing apparatus and a testing method of semiconductor integrated circuit for achieving effective heating of a probe card and reduction in cost of electric characteristic test of a semiconductor integrated circuit. SOLUTION: The testing apparatus includes a test head 11 and a probe card holder 16 detachably holding a probe card 100 including a probe 18 in contact with a semiconductor integrated circuit. Moreover, the testing apparatus further includes a heater 14 for heating the probe card 18 and a heater holding part 15 fixed to the probe card holding part 16 to hold the heater 14. The heater 14 is arranged to be in contact with the probe card 100, when the probe card 100 is held with the probe card holding part 16. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010186851(A) 申请公布日期 2010.08.26
申请号 JP20090029549 申请日期 2009.02.12
申请人 OKI SEMICONDUCTOR CO LTD 发明人 GUNJI TAKAHIRO;IWASAKI TORU;SASAKI TAKAAKI
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
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