发明名称 |
CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER |
摘要 |
<p>A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.</p> |
申请公布号 |
EP2222146(A1) |
申请公布日期 |
2010.08.25 |
申请号 |
EP20080861615 |
申请日期 |
2008.12.16 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;ITO, AKIHIRO |
分类号 |
H05K1/14;C09J7/00;C09J9/02;C09J11/04;C09J201/00;H01B5/16;H01R11/01;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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