发明名称 CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER
摘要 <p>A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.</p>
申请公布号 EP2222146(A1) 申请公布日期 2010.08.25
申请号 EP20080861615 申请日期 2008.12.16
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;ITO, AKIHIRO
分类号 H05K1/14;C09J7/00;C09J9/02;C09J11/04;C09J201/00;H01B5/16;H01R11/01;H05K3/36 主分类号 H05K1/14
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