A PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a method for manufacturing the same are provided to increase the reliability by improving shock resistance and flexibility. CONSTITUTION: A printed circuit board comprises a first polyimide film layer(110), a second polyimide film layer(120), a circuit pattern(140), and a conductive via(150). A second polyimide film layer is formed on the first polyimide film layer. A circuit pattern is buried in the second polyimide film layer. The conductive via passes through the first and the second polyimide film layer.