METHOD FOR PRODUCING ELECTRONIC PART UNIT

摘要

PURPOSE: A method of manufacturing an electronic component is provided to prevent an electronic element from bending due to the difference of coefficient of thermal expansion by suppressing thermal effect. CONSTITUTION: A first electronic component(50) is mounted in a first side of a first substrate(10) by reflow. A second electronic component(60) is mounted in a first side(21) of a second substrate by reflow. The second side of the first substrate is contacted with the first side(31) of a third substrate(30). A second side of a second substrate is contacted with a second side of the third substrate(32).