发明名称 A LED PACKAGE AND A MANUFACTURING METHOD
摘要 PURPOSE: The fluorescent material is sprayed uniformly in the LED package, the manufacturing method thereof silver reflecting body and LED chip upper side and the color spot and color breakup are eliminated completely. The color uniformity is improved. CONSTITUTION: The LED chip(10) comprises the active layer(12). The around the reflecting body(20) is the LED chip is surrounded. The lens unit(30) shields the opening of the reflecting body. The fluorescent material(40) is spread inside the reflecting body in order to change the wave length of the light created in the LED chip. The base portion supports the LED chip in downward.
申请公布号 KR20100092319(A) 申请公布日期 2010.08.20
申请号 KR20090011623 申请日期 2009.02.12
申请人 CHANGWON NATIONAL UNIVERSITY INDUSTRY ACADEMY COOPERATION CORPS 发明人 JEONG, JUN HO
分类号 H01L33/50;H01L33/52 主分类号 H01L33/50
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