| 摘要 |
A method includes: fabricating a wafer having a plurality of layers, each including a feature of interest and a lapping guide positioned at a known location relative to the feature of interest, wherein the feature of interest and the lapping guide cross a common plane; lapping the wafer to the common plane to expose portions of the lapping guides; and measuring dimensions of the lapping guides and an offset of the lapping guides with respect to each other. An apparatus constructed using the method is also included.
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