发明名称 ADHESIVE COMPOSITION, ADHESIVE SHEET, AND DICING DIE ATTACH FILM
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition not only excellent in adhesion, but also excellent in embedding performance and durability, an adhesive sheet, and a dicing die attach film using the same. SOLUTION: The adhesive composition comprises (A) a (meth)acrylic resin containing a functional group reactive with a (B) component and/or a (C) component below, and having a weight-average molecular weight of 50,000 to 1,500,000, (B) an epoxy resin having a weight-average molecular weight of≤5,000, (C) an aromatic polyamine compound, and (D) a hydrophobic spherical silica microparticle obtained by a hydrophobization process comprising a step of introducing a T unit to the surface of a specific hydrophilic spherical silica microparticle composed substantially of a Q unit, and then introducing an M unit thereto, and having a particle diameter of 0.005 to 5.0μm. The adhesive sheet comprises a substrate and a layer composed of the composition provided on the substrate. The dicing die attach film comprises a substrate, a dicing film having a pressure sensitive agent layer provided on the substrate, and a layer composed of the composition provided on the pressure sensitive agent layer. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010180334(A) 申请公布日期 2010.08.19
申请号 JP20090025527 申请日期 2009.02.06
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 KOSAKAI SHOHEI;KOUCHI SATOSHI;KUDO MUNEO
分类号 C09J133/00;C09J7/02;C09J11/04;C09J11/06;C09J163/00;H01L21/301 主分类号 C09J133/00
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