发明名称 |
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING |
摘要 |
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.
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申请公布号 |
US2010207259(A1) |
申请公布日期 |
2010.08.19 |
申请号 |
US20100770645 |
申请日期 |
2010.04.29 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIAO KUO-HSIEN;CHEN JIAN-CHENG;FAN CHEN-CHUAN;CHIU CHI-TSUNG;HUNG CHIH-PIN |
分类号 |
H01L23/552;H01L21/78 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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