发明名称 Three-dimensional miniaturized power supply
摘要 A three-dimensional miniaturized power supply is composed of at least two of a first circuit board and a second circuit board which are assembled in a chamber of a container in a three-dimensional spatial form, wherein an insulation spacing, which is in compliance with an ITE safety regulation, is provided between a circuit of the first circuit board and a circuit of the second circuit board, allowing an area and a volume of the power supply to be miniaturized, such that the power supply can be emplaced in a small container.
申请公布号 US2010207526(A1) 申请公布日期 2010.08.19
申请号 US20070004486 申请日期 2007.12.21
申请人 发明人 LIANG CHIEN-KUO
分类号 H01J7/44 主分类号 H01J7/44
代理机构 代理人
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