| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with which a pattern film with excellent low dielectric characteristics and high resolution is formed with no development residue in a pattern film forming development step, while maintaining a high residual film ratio and without damaging physical properties of the coating such as flatness, light transmittance, solvent resistance etc. after baking at high temperature. <P>SOLUTION: The photosensitive resin composition is composed of components (A), (B), and (C), with constituent ratios of the respective components set to be 5-50 pts.mass of (B) and 1-40 pts.mass of (C) based on 100 pts.mass of (A), wherein the component (A) is a copolymer composed of a constituent (a1) derived from a fumaric acid diester monomer, a constituent (a2) derived from an aromatic vinyl monomer, a constituent (a3) derived from an α,β-unsaturated carboxylic acid monomer, and a constituent (a4) derived from a (meth)acrylate monomer, the component (B) is a photosensitive agent with a quinone diazide group, and the component (C) is a curing agent with two or more epoxy groups. <P>COPYRIGHT: (C)2010,JPO&INPIT |
