SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a wiring substrate is hard to damage even by impact of falling etc. SOLUTION: In the semiconductor device, a semiconductor chip 3 mounted on the wiring substrate 1 is sealed by a resin 6 acting as a sealant. The thickness of a peripheral part 6a of the resin 6 is formed thinner compared with the thickness of the inner center part 6b. Thereby application of impact of falling to the periphery of the wiring substrate having low pressurization strength is avoided. COPYRIGHT: (C)2010,JPO&INPIT