| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical transmission module which can achieve flip-chip mounting even when an optical element for wire bonding which is not for flip-chip mounting is used, and has a superior heat dissipation characteristics. SOLUTION: In the optical transmission module in which the substrate 2 is stored in a case housing 8 and the optical element 3 having electrodes formed in an array on a surface on a side to be mounted on the substrate 2 is flip-chip mounted on the substrate 2, a module 5 for flip-chip mounting is formed by bonding the surface of the optical element 3 on the side opposite to the mounted surface to a base member 4, and the module 5 for flip-chip mounting is flip-chip mounted on the substrate 2 and is also brought into contact with the case housing 8 to form a heat dissipation path. COPYRIGHT: (C)2010,JPO&INPIT
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