| 摘要 |
<p>PURPOSE: An ultrasonic probe, an ultrasonic imaging apparatus and a fabricating method thereof are provided to control the depth of focusing, extend the ultrasonic inspection area, and obtain a clear image by adjusting ultrasonic signals or power for ultrasonic inspection through wiring arrayed in a matrix form. CONSTITUTION: An ultrasonic probe comprises a rear block(10), a flexible PCB(20), a piezoelectric wafer(50), a grounding electrode plate(60), an acoustic matching layer(70), and an acoustic lens. The flexible PCB formed with a wiring pattern is laminated into the form that surrounds the top and side of the rear block. The piezoelectric wafer is laminated on the top of the flexible PCB and has top and bottom electrodes on both sides respectively. The grounding electrode plate is laminated on the top of the piezoelectric wafer and welded to the upper electrode. The acoustic matching layer is laminated on the top of the grounding electrode plate. The acoustic lens is attached to the top of the acoustic matching layer.</p> |
