| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve bonding property without using a special material as a bonding land material and while preventing separation between a substrate and a land, in a wire bonding method for connecting a wire by wedge bonding when a bonding land on a substrate is used for secondary bonding side. <P>SOLUTION: In the wire bonding method, after primary bonding for an IC chip 20 provided to one surface of a substrate 10 by using a capillary 100, a wire 40 is subject to secondary bonding to a bonding land 30 that is projected over to one surface of the substrate 10. Before the secondary bonding step, the periphery of an inner hole 101 at the tip 102 of the capillary 100 is pressed down to the bonding land 30 to flatten the bonding land 30, and the wire 40 is bonded to the flattened portion 31 of the bonding land 30 in the secondary bonding step. <P>COPYRIGHT: (C)2010,JPO&INPIT |
