CIRCUIT CONNECTING MATERIAL, FILM-LIKE ADHESIVE, ADHESIVE REEL, AND CIRCUIT CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a circuit connecting material which has both of a sufficiently superior slit property and blocking resistance when making it film-like and can achieve a sufficiently low connection resistance when used to form a circuit connecting structure. SOLUTION: The circuit connecting material 20 is interposed between a pair of circuit electrodes located to face each other, the circuit electrodes are pressed in the facing direction to electrically connect the pair of circuit electrodes, and the material contains an adhesive composition 21 and a filler 22 dispersed into the adhesive composition 21, and the content of the filler 22 is 1 to 25 vol.%. COPYRIGHT: (C)2010,JPO&INPIT