发明名称 Light emitting diode packge, method for manufacturing the same and light source unit having the LED package
摘要 Disclosed are a high efficiency LED package with reduced production costs, a method for manufacturing the same, and a light source unit having the LED package. The method for manufacturing the LED package includes preparing a mold frame on which an LED is mounted, forming a hemi-spherical lens having a reverse-conical top part and a lateral part with haze formed by sanding or bead treatment, and fixing the lens to the mold frame to enclose the LED.
申请公布号 US2010208468(A1) 申请公布日期 2010.08.19
申请号 US20090591841 申请日期 2009.12.02
申请人 发明人 LEE SUN-HWA;SHIN HYUN-HO;NAH KEON-SOO
分类号 F21V5/00;H01J9/00 主分类号 F21V5/00
代理机构 代理人
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