| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily fit a heat dissipating means to a surface mount device 50. <P>SOLUTION: Solder is supplied onto a surface of the surface mount component 50 first by mask printing or soldering by a soldering robot. Then, the surface mount component 50 is put in a closed tank, and a rapid heating process and a slow cooling process are repeatedly performed on the surface mount component 50 to change the solder 70 on the surface mount component 50 into the heat dissipating means comprising the solder 70 having a plurality of projections 70a in irregular shapes. Consequently, the surface mount component 50 with the heat dissipating means, in which the heat dissipating means composed of the solder 70 is fixed onto the surface, can be easily obtained. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
