发明名称 |
LASER DICING APPARATUS HAVING OPTICAL FIBER ASSEMBLY |
摘要 |
PURPOSE: A laser dicing apparatus having an optical fiber assembly is provided to regulate the diameter of laser beam by changing the diameter of optical fiber in the optical fiber assembly. CONSTITUTION: A laser dicing apparatus comprises a laser beam source(57), a body portion(59), and an optical fiber assembly(69). Laser beam(71) provided from the laser beam source is delivered to the body portion. The optical fiber assembly is coupled to the body portion and determines the diameter of the laser beam to be irradiated to the cut portion of a wafer. The optical fiber assembly includes a light pass member and optical fiber connected to the light pass member, wherein the diameter of the laser beam is controlled by the diameter of the optical fiber. |
申请公布号 |
KR20100091834(A) |
申请公布日期 |
2010.08.19 |
申请号 |
KR20090011205 |
申请日期 |
2009.02.11 |
申请人 |
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. |
发明人 |
RHEE, WON SANG;HWANG, SUN HA |
分类号 |
B23K26/38;H01L21/301 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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