| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate, along with a manufacturing method thereof and an inspection method thereof, capable of readily and accurately inspecting the state of an interlayer connection between an electronic component and a wiring layer on a multilayer printed wiring board. <P>SOLUTION: A work board 100 includes an insulating layer 21 on a substrate 11, with an electronic component 41 and a plate-like integrated frame 51, which is embedded the insulating layer 21. Wiring layers 31 and 34 are formed on the electronic component 41, and the plate-like is integrated frame 51, respectively; the wiring layer 34 is used as a measurement electrode 34, and a measurement electrode 35 is formed which is made to face the plate-like integrated frame 51. The measurement electrodes 34 and 35 are applied with a voltage to measure the electrical capacity between the measurement electrode 35 and the plate-like integrated frame 51. <P>COPYRIGHT: (C)2010,JPO&INPIT |
