| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of precisely polishing a plurality of workpieces to be polished at the same time. <P>SOLUTION: The polishing apparatus 1 includes a polishing pad 11 having a polishing surface capable of polishing the workpieces 5, 6; a polishing platen capable of rotating while holding the polishing pad 11 with its polishing surface facing up; and a plurality of head portions 20a-20c disposed above the polishing platen and holding the workpieces 5, 6 with their surfaces to be polished facing down. The polishing pad 11 is configured to be able to simultaneously polish the plurality of workpieces 5, 6 individually held by the plurality of head portions 20a-20c, and is provided with head drive mechanisms 30a-30c which move each of the plurality of head portions 20a-20c in a two-dimensional direction substantially parallel to the polishing surface of the polishing pad 11. <P>COPYRIGHT: (C)2010,JPO&INPIT |
