发明名称 Adhesive bonding method
摘要 The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned.
申请公布号 US2010200147(A1) 申请公布日期 2010.08.12
申请号 US20090458842 申请日期 2009.07.23
申请人 SAE MAGNETICS (H.K.) LTD. 发明人 MAK WINGKEUNG;SIU TINHOI;LIU XIAOXI;GUILLEN GAMBOA;GONG DIANJUN;SI WEI
分类号 B32B38/00;B32B37/06 主分类号 B32B38/00
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