| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible substrate that can effectively dissipate heat of a mounted electronic component without using a heat radiating substrate and can miniaturize the same in a state in which the electronic component is mounted. Ž<P>SOLUTION: The flexible substrate has a laminar substrate 4, a wiring pattern 5 prepared on one surface of the substrate, a heat radiating pattern 6 prepared on the other surface of the substrate, a via-hole 7 formed on the substrate such that it runs from one surface to the other of the substrate, and a heat sink 8 prepared in the via-hole, wherein the end at the heat radiating pattern side of the heat sink is connected such that it can transfer heat to the heat radiating pattern, and in the outer periphery of the perimeter at the wiring pattern side end part of the heat sink, a connecting terminal 9 for connecting to an electronic component is allocated, the connecting terminal being formed by a part of the wiring pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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