| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of checking the state of soldering of a discharge electrode easily in a short time. Ž<P>SOLUTION: A printed circuit board 10 provided with the solder pads 11b provided on the printed circuit board 10 for the leads, the solder pads 11a for the heat dissipation electrode, and test points 12 projecting from the solder pads 11a is connected with an electronic component 20 having the leads 23 provided on the body 22, the heat dissipation electrode 21 formed on the footprint of the body 22, and the soldering check portions 24 projecting from the heat dissipation electrode 21 on the footprint of the body 22 by fusing the solder 13. Normal connection is checked visually by checking whether a solder fillet 15 is formed from between the test points 12 and the soldering check portion 24 or not. Alternatively, normal soldering is checked by measuring conduction between two test points 12 by means of a tester after the solder 13 is heated, fused and hardened. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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