| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-silver based lead-free solder alloy which has excellent wetting properties and excellent thermal fatigue characteristics, to provide a solder-paste type soldering material and a flux-cored soldering material which exhibit excellent fatigue resistance, and to provide joined products using the soldering materials. <P>SOLUTION: The low-silver based lead-free solder alloy contains, by weight, 0.1 to 1.5% Cu, 0.01 to less than 0.05% Co, 0.05 to 0.25% Ag, and 0.001 to 0.008% Ge with the balance Sn. The soldering materials are prepared either by mixing a low-silver based lead-free solder alloy with a pasty flux, or by forming the solder alloy into a wire shape with a solid or pasty flux as the core. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
