发明名称 PLATING APPARATUS FOR HOOP MATERIAL, AND CONTINUOUS PLATING METHOD FOR HOOP MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plating apparatus for a hoop material, which reduces the leakage of a treatment liquid from a slit and does not form a scratch on the surface of the hoop material, and to provide a continuous plating method for a hoop material using the same. SOLUTION: In the plating apparatus for the hoop material, which transports the hoop material 5 into a treatment tank 1 having the slits for an inlet and an outlet and continuously passes the hoop material through an inner cell 2 to immerse the hoop material in a plating solution, the plating apparatus for the hoop material has a liquid leakage prevention mechanism formed by arranging a plurality of sets of rods in pairs which are positioned on one face side and the other face side of the hoop material 5, in the vicinity of the slits 3 for the inlet and the outlet of the inner cell 2, wherein the rods are accommodated in holders, and the ends of the holders are fixed on a supporting plate 8 which is continuously connected to the inner cell 2, in such a state that the positions of the holder and the hoop material 5 can be adjusted. The continuous plating method for the hoop material is also disclosed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010174265(A) 申请公布日期 2010.08.12
申请号 JP20090014943 申请日期 2009.01.27
申请人 SUMITOMO METAL MINING CO LTD 发明人 KOBAYASHI TAKASHI
分类号 C25D7/06 主分类号 C25D7/06
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