| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a multi-beam deflector array device with a plurality of openings for use in a projection lithography system. <P>SOLUTION: This method starts from a CMOS wafer and comprises steps of: generating at least one pair of parallel trenches on the first side of the wafer blank at the edges of an area where the circuitry layer below is non-functional, the trenches reaching into the layer of bulk material; protecting the sidewalls and bottom of the trenches; depositing a conducting filling material into the trenches, thus creating columns of filling material serving as electrodes 112; attaching metallic contact means to the top of the electrodes; structuring of an opening between the electrodes, the opening stretching across the area so that the columns are arranged opposite of each other on the sidewalls of the opening 110. <P>COPYRIGHT: (C)2010,JPO&INPIT |
