| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device capable of being miniaturized and improving mechanical strength. Ž<P>SOLUTION: The piezoelectric device 1 includes a package 3 housing a piezoelectric body element 2, a mounting board 4 for supporting the package 3 through a column member 51, and an electronic component 6 provided on the mounting board 4 so as to be positioned in a gap between the package 3 and the mounting board 4 formed of the column member 51 for driving the piezoelectric body element 2. The column member 51 has a recessed part 512 formed on an upper end face 511 at the side of the package 3, and the column member 51 and the package 3 are bonded with solder accumulated in the recessed part 512. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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