发明名称 Semiconductor device and method of manufacturing same
摘要 A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.
申请公布号 US7772658(B2) 申请公布日期 2010.08.10
申请号 US20070849328 申请日期 2007.09.03
申请人 FUJI ELECTRIC SYSTEMS CO., LTD. 发明人 UEMATSU KATSUYUKI;SHINODA SHIGERU;ASHINO KIMIHIRO
分类号 H01L29/84 主分类号 H01L29/84
代理机构 代理人
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