发明名称 Tool for semiconductor package
摘要 A tool for making the semiconductor package accurately contact with the terminals of a electrical connector, comprises a body with a through hole for passing through the semiconductor package thereof, a plurality of the latching members mounted on the body and a guiding member, the guiding member is received in the body and could move up and down relative to the body. The guiding member of the invention is a floatable model to decrease the damage of the semiconductor package while loading.
申请公布号 US7770289(B2) 申请公布日期 2010.08.10
申请号 US20070904517 申请日期 2007.09.26
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 CHEN MING-YUE;LIN CHUN-FU
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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